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0026605130

0026605130 Molex


0026605130_pcb_headers.pdf Hersteller: Molex
Conn Wire to Board HDR 13 POS 3.96mm Solder RA Thru-Hole KK® Bag
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Technische Details 0026605130 Molex

Description: CONN HEADER R/A 13POS 3.96MM, Packaging: Bulk, Connector Type: Header, Mounting Type: Through Hole, Right Angle, Number of Positions: 13, Number of Rows: 1, Style: Board to Board or Cable, Contact Type: Male Pin, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.156" (3.96mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Contact Shape: Square, Contact Length - Post: 0.156" (3.96mm), Insulation Height: 0.394" (10.00mm), Shrouding: Shrouded - 1 Wall, Insulation Material: Polyester, Glass Filled, Contact Length - Mating: 0.450" (11.43mm).

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0026605130 Hersteller : Molex KK_41792_Dwg.pdf Description: CONN HEADER R/A 13POS 3.96MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 13
Number of Rows: 1
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.156" (3.96mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.156" (3.96mm)
Insulation Height: 0.394" (10.00mm)
Shrouding: Shrouded - 1 Wall
Insulation Material: Polyester, Glass Filled
Contact Length - Mating: 0.450" (11.43mm)
Produkt ist nicht verfügbar