0097055509 Laird Technologies EMI
Hersteller: Laird Technologies EMI
Description: TWT,STR,NID,PSA
Part Status: Active
Plating - Thickness: 299.21µin (7.60µm)
Plating: Nickel
Attachment Method: Adhesive
Height: 0.030" (0.76mm)
Operating Temperature: 121°C
Width: 0.230" (5.84mm)
Type: Fingerstock
Length: 24.000" (609.60mm)
Material: Beryllium Copper
Packaging: Bulk
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Technische Details 0097055509 Laird Technologies EMI
Description: TWT,STR,NID,PSA, Part Status: Active, Plating - Thickness: 299.21µin (7.60µm), Plating: Nickel, Attachment Method: Adhesive, Height: 0.030" (0.76mm), Operating Temperature: 121°C, Width: 0.230" (5.84mm), Type: Fingerstock, Length: 24.000" (609.60mm), Material: Beryllium Copper, Packaging: Bulk.
Weitere Produktangebote 0097055509
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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0097055509 | Hersteller : Laird Performance Materials |
EMI Gaskets, Sheets, Absorbers & Shielding TWT,STR,NiD,PSA .070x.340x.165x24 |
Produkt ist nicht verfügbar |