0098050017 Laird Technologies EMI
Hersteller: Laird Technologies EMI
Description: HDWE GROUNDING STRIP
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.600" (15.24mm)
Operating Temperature: 121°C
Height: 0.230" (5.84mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Part Status: Active
Description: HDWE GROUNDING STRIP
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.600" (15.24mm)
Operating Temperature: 121°C
Height: 0.230" (5.84mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Part Status: Active
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Technische Details 0098050017 Laird Technologies EMI
Description: HDWE GROUNDING STRIP, Packaging: Bulk, Material: Beryllium Copper, Length: 24.000" (609.60mm), Type: Fingerstock, Width: 0.600" (15.24mm), Operating Temperature: 121°C, Height: 0.230" (5.84mm), Attachment Method: Adhesive, Plating: Tin, Plating - Thickness: 299.21µin (7.60µm), Part Status: Active.