
03-0518-10 Aries Electronics
auf Bestellung 280 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
3+ | 1.12 EUR |
10+ | 0.70 EUR |
500+ | 0.55 EUR |
2500+ | 0.54 EUR |
5000+ | 0.53 EUR |
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Technische Details 03-0518-10 Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 03-0518-10 nach Preis ab 0.73 EUR bis 0.73 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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03-0518-10 | Hersteller : Aries Electronics |
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auf Bestellung 400 Stücke: Lieferzeit 14-21 Tag (e) |
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03-0518-10 | Hersteller : Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |