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0430450811

0430450811 Molex


430450811_sd.pdf Hersteller: Molex
Description: CONN HEADER SMD R/A 8POS 3MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 1800 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
200+7.92 EUR
1000+6.52 EUR
Mindestbestellmenge: 200
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details 0430450811 Molex

Description: CONN HEADER SMD R/A 8POS 3MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): 8A, Mounting Type: Surface Mount, Right Angle, Number of Positions: 8, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.290" (7.37mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).

Weitere Produktangebote 0430450811 nach Preis ab 7.92 EUR bis 11.18 EUR

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0430450811 0430450811 Hersteller : Molex 430450811_sd.pdf Description: CONN HEADER SMD R/A 8POS 3MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 1904 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.18 EUR
10+9.78 EUR
100+7.92 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
0430450811 0430450811 Hersteller : Molex 0430450811.pdf Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0™ T/R
auf Bestellung 440 Stücke:
Lieferzeit 14-21 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
0430450811 Hersteller : Molex 0430450811.pdf Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0™ T/R
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
0430450811 0430450811 Hersteller : Molex 430450811_sd.pdf Headers & Wire Housings MICRO-FIT 3.0 HDR 02X04P RA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH