0430452009 Molex
auf Bestellung 4000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 1000+ | 3.99 EUR |
| 2000+ | 3.79 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 0430452009 Molex
Description: CONN HEADER SMD R/A 20POS 3MM, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Right Angle, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.290" (7.37mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).
Weitere Produktangebote 0430452009 nach Preis ab 3.80 EUR bis 12.53 EUR
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0430452009 | Hersteller : Molex |
 Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 4000 Stücke: Lieferzeit 14-21 Tag (e) |
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0430452009 | Hersteller : Molex |
Description: CONN HEADER SMD R/A 20POS 3MM Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
auf Bestellung 1600 Stücke: Lieferzeit 10-14 Tag (e) |
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0430452009 | Hersteller : Molex |
Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 41 Stücke: Lieferzeit 14-21 Tag (e) |
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0430452009 | Hersteller : Molex |
Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 41 Stücke: Lieferzeit 14-21 Tag (e) |
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0430452009 | Hersteller : Molex |
Description: CONN HEADER SMD R/A 20POS 3MM Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
auf Bestellung 1787 Stücke: Lieferzeit 10-14 Tag (e) |
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0430452009 | Hersteller : Molex |
Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0™ T/R |
auf Bestellung 4550 Stücke: Lieferzeit 14-21 Tag (e) |
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0430452009 | Hersteller : Molex |
Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
Produkt ist nicht verfügbar |
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0430452009 | Hersteller : Molex |
Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
Produkt ist nicht verfügbar |