0466220400 Molex
auf Bestellung 1519 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 278+ | 0.52 EUR |
| 283+ | 0.49 EUR |
| 287+ | 0.47 EUR |
| 292+ | 0.44 EUR |
| 297+ | 0.42 EUR |
| 500+ | 0.39 EUR |
| 1000+ | 0.37 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 0466220400 Molex
Description: CONN HEADER SMD R/A 4POS 3MM, Features: Blind Mating, Board Guide, Packaging: Tape & Reel (TR), Connector Type: Header, Mounting Type: Surface Mount, Right Angle, Number of Positions: 4, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled.
Weitere Produktangebote 0466220400 nach Preis ab 0.37 EUR bis 2.8 EUR
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0466220400 | Hersteller : Molex |
 Conn Wire to Board HDR 4 POS 3mm Solder RA Side Entry SMD Micro-Fit BMI T/R |
auf Bestellung 1519 Stücke: Lieferzeit 14-21 Tag (e) |
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0466220400 | Hersteller : Molex |
Description: CONN HEADER SMD R/A 4POS 3MM Features: Blind Mating, Board Guide Packaging: Cut Tape (CT) Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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0466220400 | Hersteller : Molex |
Conn Wire to Board HDR 4 POS 3mm Solder RA Side Entry SMD Micro-Fit BMI™ T/R |
Produkt ist nicht verfügbar |
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0466220400 | Hersteller : Molex |
Description: CONN HEADER SMD R/A 4POS 3MM Features: Blind Mating, Board Guide Packaging: Tape & Reel (TR) Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
Produkt ist nicht verfügbar |