05-0518-00 Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
| Anzahl | Preis |
|---|---|
| 8+ | 2.2 EUR |
| 10+ | 1.86 EUR |
| 25+ | 1.74 EUR |
| 50+ | 1.66 EUR |
| 100+ | 1.58 EUR |
| 250+ | 1.48 EUR |
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Technische Details 05-0518-00 Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Surface Mount, Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.