0750050204 Molex
Hersteller: Molex
Description: CONN DIFF ARRAY RCP 72P SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 10mm, 13mm, 15mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.285" (7.24mm)
Pitch: 0.047" (1.20mm)
Number of Positions: 72
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Female
Features: Board Guide
Packaging: Tape & Reel (TR)
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Technische Details 0750050204 Molex
Description: CONN DIFF ARRAY RCP 72P SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 10mm, 13mm, 15mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.285" (7.24mm), Pitch: 0.047" (1.20mm), Number of Positions: 72, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Female, Features: Board Guide, Packaging: Tape & Reel (TR).
Weitere Produktangebote 0750050204
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
|
0750050204 | Molex |
Description: CONN DIFF ARRAY RCP 72P SMD GOLD Contact Finish: Gold Connector Type: Differential Pair Array, Female Features: Board Guide Packaging: Cut Tape (CT) Number of Rows: 2 Mated Stacking Heights: 10mm, 13mm, 15mm Contact Finish Thickness: 30.0µin (0.76µm) Height Above Board: 0.285" (7.24mm) Pitch: 0.047" (1.20mm) Number of Positions: 72 Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
 |
0750050204 | Molex |
Conn Board to Board RCP 72 POS 1.2mm Solder ST Top Entry SMD Plateau HS Mezz T/R |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 275 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 0750050204 |
|
Hersteller: Molex
Description: CONN DIFF ARRAY RCP 72P SMD GOLD
Contact Finish: Gold
Connector Type: Differential Pair Array, Female
Features: Board Guide
Packaging: Cut Tape (CT)
Number of Rows: 2
Mated Stacking Heights: 10mm, 13mm, 15mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.285" (7.24mm)
Pitch: 0.047" (1.20mm)
Number of Positions: 72
Mounting Type: Surface Mount
Description: CONN DIFF ARRAY RCP 72P SMD GOLD
Contact Finish: Gold
Connector Type: Differential Pair Array, Female
Features: Board Guide
Packaging: Cut Tape (CT)
Number of Rows: 2
Mated Stacking Heights: 10mm, 13mm, 15mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.285" (7.24mm)
Pitch: 0.047" (1.20mm)
Number of Positions: 72
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 0750050204 |
|
Hersteller: Molex
Conn Board to Board RCP 72 POS 1.2mm Solder ST Top Entry SMD Plateau HS Mezz T/R
Conn Board to Board RCP 72 POS 1.2mm Solder ST Top Entry SMD Plateau HS Mezz T/R
Produkt ist nicht verfügbar
Mindestbestellmenge: 275 Stücke
Im Einkaufswagen
Stück im Wert von UAH