Technische Details 0750050204 Molex
Description: CONN DIFF ARRAY RCP 72P SMD GOLD, Features: Board Guide, Packaging: Tape & Reel (TR), Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 72, Pitch: 0.047" (1.20mm), Height Above Board: 0.285" (7.24mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 10mm, 13mm, 15mm, Number of Rows: 2.
Weitere Produktangebote 0750050204
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0750050204 | Hersteller : Molex |
 Conn Board to Board RCP 72 POS 1.2mm Solder ST SMD Plateau HS Mezz™ T/R |
Produkt ist nicht verfügbar |
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0750050204 | Hersteller : Molex |
Description: CONN DIFF ARRAY RCP 72P SMD GOLD Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 72 Pitch: 0.047" (1.20mm) Height Above Board: 0.285" (7.24mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 10mm, 13mm, 15mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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0750050204 | Hersteller : Molex |
Description: CONN DIFF ARRAY RCP 72P SMD GOLD Features: Board Guide Packaging: Cut Tape (CT) Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 72 Pitch: 0.047" (1.20mm) Height Above Board: 0.285" (7.24mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 10mm, 13mm, 15mm Number of Rows: 2 |
Produkt ist nicht verfügbar |