0750050304 Molex
Hersteller: MolexDescription: CONN DIFF ARRAY RCP 12P SMD GOLD
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 12
Pitch: 0.047" (1.20mm)
Height Above Board: 0.285" (7.24mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 10mm, 13mm, 15mm
Number of Rows: 2
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 24.39 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 0750050304 Molex
Description: CONN DIFF ARRAY RCP 12P SMD GOLD, Features: Board Guide, Packaging: Tape & Reel (TR), Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 12, Pitch: 0.047" (1.20mm), Height Above Board: 0.285" (7.24mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 10mm, 13mm, 15mm, Number of Rows: 2.
Weitere Produktangebote 0750050304
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
0750050304 | Hersteller : Molex |
Conn Board to Board RCP 12 POS 1.2mm Solder ST SMD Plateau HS Mezz™ T/R |
Produkt ist nicht verfügbar |
|
|
|
0750050304 | Hersteller : Molex |
Description: CONN DIFF ARRAY RCP 12P SMD GOLD Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 12 Pitch: 0.047" (1.20mm) Height Above Board: 0.285" (7.24mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 10mm, 13mm, 15mm Number of Rows: 2 |
Produkt ist nicht verfügbar |