08-350000-10-HT Aries Electronics

Description: SOCKET ADAPTER SOIC TO 8DIP 0.3, Packaging: Bulk, Number of Pins: 8, Mounting Type: Through Hole, Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm), Proto Board Type: DIP to DIP, Convert From (Adapter End): SOIC, Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing, Termination: Solder, Package Accepted: SOIC, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Board Material: Polyimide (PI), Part Status: Active.