| Anzahl | Privatkunde |
|---|---|
| 49+ | 1.27 EUR |
| 98+ | 1.05 EUR |
| 539+ | 0.94 EUR |
| 1029+ | 0.86 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 08-3518-10 Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote 08-3518-10 nach Preis ab 1.39 EUR bis 2.18 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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08-3518-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET 8POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
auf Bestellung 725 Stücke: Lieferzeit 10-14 Tag (e) |
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08-3518-10 | ARIES |
Description: ARIES - 08-3518-10 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 518, 7.62 mm, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 8Kontakt(e) Reihenabstand: 7.62mm Steckverbinder: DIP-Sockel Produktpalette: 518 productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 2931 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 08-3518-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 725 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.18 EUR |
| 12+ | 1.84 EUR |
| 49+ | 1.64 EUR |
| 98+ | 1.57 EUR |
| 147+ | 1.52 EUR |
| 294+ | 1.45 EUR |
| 539+ | 1.39 EUR |
| 08-3518-10 |
|
Hersteller: ARIES
Description: ARIES - 08-3518-10 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: 518
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 08-3518-10 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: 518
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 2931 Stücke:
Lieferzeit 14-21 Tag (e)