08-6810-90C Aries Electronics
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 14.59 EUR |
| 10+ | 13.34 EUR |
| 25+ | 12.94 EUR |
| 100+ | 12.60 EUR |
| 250+ | 11.95 EUR |
| 500+ | 11.32 EUR |
| 1000+ | 10.58 EUR |
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Technische Details 08-6810-90C Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Vertical, Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote 08-6810-90C
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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08-6810-90C | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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