09-0513-10T Aries Electronics
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.43 EUR |
| 10+ | 2.11 EUR |
| 25+ | 2.01 EUR |
| 100+ | 1.9 EUR |
| 250+ | 1.51 EUR |
| 2500+ | 1.45 EUR |
| 5000+ | 1.42 EUR |
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Technische Details 09-0513-10T Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote 09-0513-10T
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 09-0513-10T | Hersteller : Aries Electronics |
 Description: CONN SOCKET SIP 9POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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