1-104894-5 TE Connectivity AMP Connectors

Description: CONN HEADER SMD R/A 50POS 1.27MM
Packaging: Bulk
Features: Board Lock, Solder Retention
Connector Type: Header
Current Rating (Amps): 0.5A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 50
Number of Rows: 2
Style: Board to Board
Operating Temperature: -65°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Circular
Insulation Height: 0.213" (5.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
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Technische Details 1-104894-5 TE Connectivity AMP Connectors
Description: CONN HEADER SMD R/A 50POS 1.27MM, Packaging: Bulk, Features: Board Lock, Solder Retention, Connector Type: Header, Current Rating (Amps): 0.5A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 50, Number of Rows: 2, Style: Board to Board, Operating Temperature: -65°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Shape: Circular, Insulation Height: 0.213" (5.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm).
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1-104894-5 | Hersteller : TE Connectivity |
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