1-1825094-3 TE Connectivity
auf Bestellung 1999 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 94+ | 1.55 EUR |
| 350+ | 1.46 EUR |
| 650+ | 1.38 EUR |
| 1300+ | 1.3 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 1-1825094-3 TE Connectivity
Description: CONN IC DIP SOCKET 14POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Thermoplastic, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Weitere Produktangebote 1-1825094-3
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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1-1825094-3 | Hersteller : TE CONNECTIVITY / PARTNER STOCK |
 Description: TE CONNECTIVITY / PARTNER STOCK - 1-1825094-3 - IC- & Baustein-Sockel, 14 Kontakt(e), DIP-Sockel, 2.54 mm, DIPLOMATE DL Series, 7.62 mmtariffCode: 85366990 productTraceability: No Kontaktüberzug: Vergoldete Kontakte rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 14Kontakt(e) Steckverbinder: DIP-Sockel euEccn: NLR isCanonical: Y Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: DIPLOMATE DL Series SVHC: To Be Advised |
auf Bestellung 1800 Stücke: Lieferzeit 14-21 Tag (e) |
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1-1825094-3 | Hersteller : TE Connectivity |
Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube |
Produkt ist nicht verfügbar |
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1-1825094-3 | Hersteller : TE Connectivity |
Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube |
Produkt ist nicht verfügbar |
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1-1825094-3 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Thermoplastic, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
Produkt ist nicht verfügbar |