1-1825376-2 TE Connectivity
auf Bestellung 1230 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 45+ | 3.5 EUR |
| 150+ | 3.31 EUR |
| 300+ | 3.13 EUR |
| 600+ | 2.96 EUR |
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Technische Details 1-1825376-2 TE Connectivity
Description: CONN IC DIP SOCKET 28POS GOLD, Features: Closed Frame, Packaging: Tray, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Thermoplastic, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 1-1825376-2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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1-1825376-2 | Hersteller : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 28POS GOLDFeatures: Closed Frame Packaging: Tray Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Thermoplastic, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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1-1825376-2 | Hersteller : TE Connectivity |
IC & Component Sockets 28P LB SKT; RET .600 CL; 30AU/SN BECU |
Produkt ist nicht verfügbar |