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1-1825376-3

1-1825376-3 TE Connectivity

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Hersteller: TE Connectivity
Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Tube
auf Bestellung 860 Stücke:
Lieferzeit 14-21 Tag (e)
AnzahlPrivatkunde
33+5.44 EUR
150+5.26 EUR
250+5.03 EUR
450+4.84 EUR
Mindestbestellmenge: 33 Stücke
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Technische Details 1-1825376-3 TE Connectivity

Description: CONN IC DIP SOCKET 40POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Thermoplastic, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 40 (2 x 20), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.

Weitere Produktangebote 1-1825376-3

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
1-1825376-3 1-1825376-3 TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=1825376&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1-1825376-3 1-1825376-3 TE Connectivity DDEController?Action=srchrtrv&DocNm=1825376&DocType=Customer+Drawing&DocLang=English IC & Component Sockets 40P LB SKT RET .600 CL 30AU/SN BECU
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1-1825376-3 DDEController?Action=srchrtrv&DocNm=1825376&DocType=Customer+Drawing&DocLang=English
1-1825376-3
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1-1825376-3 DDEController?Action=srchrtrv&DocNm=1825376&DocType=Customer+Drawing&DocLang=English
1-1825376-3
Hersteller: TE Connectivity
IC & Component Sockets 40P LB SKT RET .600 CL 30AU/SN BECU
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH