10-2823-90T Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
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Technische Details 10-2823-90T Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN, Mounting Type: Through Hole, Right Angle, Horizontal, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Solder, Number of Positions or Pins (Grid): 10 (2 x 5), Type: DIP, 0.2" (5.08mm) Row Spacing.
Weitere Produktangebote 10-2823-90T
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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10-2823-90T | Hersteller : Aries Electronics |
IC & Component Sockets VERTISOCKETS HORIZ BIFURCATED 10 PINS |
Produkt ist nicht verfügbar |