10-3513-10 Aries Electronics
Hersteller: Aries ElectronicsDescription: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
auf Bestellung 1429 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 2.83 EUR |
| 10+ | 2.4 EUR |
| 25+ | 2.25 EUR |
| 50+ | 2.14 EUR |
| 100+ | 2.04 EUR |
| 250+ | 1.91 EUR |
| 500+ | 1.82 EUR |
| 1000+ | 1.73 EUR |
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Technische Details 10-3513-10 Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote 10-3513-10 nach Preis ab 1.71 EUR bis 2.9 EUR
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10-3513-10 | Hersteller : Aries Electronics |
IC & Component Sockets 10P SOLDER TAIL PIN GOLD / TIN COLLET |
auf Bestellung 462 Stücke: Lieferzeit 10-14 Tag (e) |
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