10-6327-01G + T725 PAD Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: 10-6327-01G + T725 PAD
Length: 1.122" (28.50mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Attachment Method: Push Pin
Package Cooled: BGA, FPGA
Width: 1.122" (28.50mm)
Type: Board Level
Shape: Square, Pin Fins
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Technische Details 10-6327-01G + T725 PAD Boyd Laconia, LLC
Description: 10-6327-01G + T725 PAD, Length: 1.122" (28.50mm), Material: Aluminum, Packaging: Bulk, Material Finish: Black Anodized, Fin Height: 0.394" (10.00mm), Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM, Power Dissipation @ Temperature Rise: 1.0W @ 30°C, Attachment Method: Push Pin, Package Cooled: BGA, FPGA, Width: 1.122" (28.50mm), Type: Board Level, Shape: Square, Pin Fins.
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