10-6327-01G + T725 PAD Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: 10-6327-01G + T725 PAD
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.122" (28.50mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: 10-6327-01G + T725 PAD
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.122" (28.50mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
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Technische Details 10-6327-01G + T725 PAD Boyd Laconia, LLC
Description: 10-6327-01G + T725 PAD, Packaging: Bulk, Material: Aluminum, Length: 1.122" (28.50mm), Shape: Square, Pin Fins, Type: Board Level, Width: 1.122" (28.50mm), Package Cooled: BGA, FPGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 1.0W @ 30°C, Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote 10-6327-01G + T725 PAD
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Preis |
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| 10-6327-01G + T725 PAD | Hersteller : Aavid | Heat Sinks |
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