Technische Details 10-6327-01G + T725 PAD Aavid Thermalloy
Description: 10-6327-01G + T725 PAD, Packaging: Bulk, Material: Aluminum, Length: 1.122" (28.50mm), Shape: Square, Pin Fins, Type: Board Level, Width: 1.122" (28.50mm), Package Cooled: BGA, FPGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 1.0W @ 30°C, Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote 10-6327-01G + T725 PAD
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| 10-6327-01G + T725 PAD | Hersteller : Boyd Laconia, LLC |
Description: 10-6327-01G + T725 PAD Packaging: Bulk Material: Aluminum Length: 1.122" (28.50mm) Shape: Square, Pin Fins Type: Board Level Width: 1.122" (28.50mm) Package Cooled: BGA, FPGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 1.0W @ 30°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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| 10-6327-01G + T725 PAD | Hersteller : Aavid | Heat Sinks |
Produkt ist nicht verfügbar |