10-71250-10 Aries Electronics
auf Bestellung 14 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 27.09 EUR |
10+ | 24 EUR |
25+ | 23.06 EUR |
100+ | 20.9 EUR |
250+ | 19.06 EUR |
500+ | 17.84 EUR |
1000+ | 16.35 EUR |
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Technische Details 10-71250-10 Aries Electronics
Description: CONN SOCKET SIP 10POS TIN, Features: Elevated, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 10 (1 x 10), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote 10-71250-10
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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10-71250-10 | Hersteller : Aries Electronics |
Description: CONN SOCKET SIP 10POS TIN Features: Elevated Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
Produkt ist nicht verfügbar |