
10073228-10002TLF Amphenol Communications Solutions

PCI Express® GEN 3 Card Edge, Storage and Server Connector, for SIOM, Vertical, Surface Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch
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Technische Details 10073228-10002TLF Amphenol Communications Solutions
Description: CONN PCI EXP FMALE 98POS 0.039, Features: Board Guide, Locking Ramp, Solder Retention, Packaging: Tray, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 98, Pitch: 0.039" (1.00mm), Read Out: Dual, Card Type: PCI Express™, Card Thickness: 0.062" (1.57mm), Termination: Solder, Contact Finish Thickness: 30.0µin (0.76µm), Contact Material: Copper Alloy, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote 10073228-10002TLF
Foto | Bezeichnung | Hersteller | Beschreibung |
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10073228-10002TLF | Hersteller : Amphenol ICC (FCI) |
![]() Features: Board Guide, Locking Ramp, Solder Retention Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 98 Pitch: 0.039" (1.00mm) Read Out: Dual Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Copper Alloy Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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10073228-10002TLF | Hersteller : Amphenol FCI |
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Produkt ist nicht verfügbar |