10165968-113Q700LF Amphenol FCI
| Anzahl | Privatkunde |
|---|---|
| 1+ | 17.97 EUR |
| 10+ | 16.17 EUR |
| 25+ | 15.24 EUR |
| 50+ | 14.88 EUR |
| 100+ | 14.47 EUR |
| 300+ | 12.9 EUR |
| 600+ | 12.13 EUR |
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Lieferzeit:
10-14 Tag (e)
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Technische Details 10165968-113Q700LF Amphenol FCI
Description: INTERCONNECT RECTANGULAR, Features: Board Guide, Locking Ramp, Solder Retention, Packaging: Tray, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 164, Pitch: 0.039" (1.00mm), Operating Temperature: -55°C ~ 85°C, Read Out: Dual, Contact Type: Cantilever, Card Type: PCI Express™, Card Thickness: 0.062" (1.57mm), Termination: Solder, Contact Finish Thickness: 30.0µin (0.76µm), Contact Material: Copper Alloy, Number of Positions/Bay/Row: 11; 71, Number of Rows: 2.
Weitere Produktangebote 10165968-113Q700LF
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
| 10165968-113Q700LF | Amphenol ICC (FCI) |
 Description: INTERCONNECT RECTANGULARFeatures: Board Guide, Locking Ramp, Solder Retention Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 164 Pitch: 0.039" (1.00mm) Operating Temperature: -55°C ~ 85°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Copper Alloy Number of Positions/Bay/Row: 11; 71 Number of Rows: 2 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1800 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 10165968-113Q700LF |
|
Hersteller: Amphenol ICC (FCI)
Description: INTERCONNECT RECTANGULAR
Features: Board Guide, Locking Ramp, Solder Retention
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 164
Pitch: 0.039" (1.00mm)
Operating Temperature: -55°C ~ 85°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Copper Alloy
Number of Positions/Bay/Row: 11; 71
Number of Rows: 2
Description: INTERCONNECT RECTANGULAR
Features: Board Guide, Locking Ramp, Solder Retention
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 164
Pitch: 0.039" (1.00mm)
Operating Temperature: -55°C ~ 85°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Copper Alloy
Number of Positions/Bay/Row: 11; 71
Number of Rows: 2
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen
Stück im Wert von UAH