auf Bestellung 673 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 10.05 EUR |
| 10+ | 9.1 EUR |
| 25+ | 8.59 EUR |
| 50+ | 8.38 EUR |
| 100+ | 7.96 EUR |
| 250+ | 5.93 EUR |
| 500+ | 5.84 EUR |
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Technische Details 105405-2304 Molex
Description: CONN HEADER SMD R/A 4POS 2.5MM, Packaging: Tray, Connector Type: Header, Mounting Type: Surface Mount, Right Angle, Number of Positions: 4, Number of Rows: 2, Style: Board to Cable/Wire, Contact Type: Male Pin, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Contact Material: Brass, Insulation Color: Natural, Pitch - Mating: 0.098" (2.50mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.247" (6.28mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.098" (2.50mm).
Weitere Produktangebote 105405-2304
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
1054052304 | Hersteller : Molex |
 Description: CONN HEADER SMD R/A 4POS 2.5MMPackaging: Tray Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Number of Rows: 2 Style: Board to Cable/Wire Contact Type: Male Pin Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Contact Material: Brass Insulation Color: Natural Pitch - Mating: 0.098" (2.50mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.247" (6.28mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.098" (2.50mm) |
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