auf Bestellung 355 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 13.82 EUR |
| 10+ | 10.58 EUR |
| 20+ | 9.94 EUR |
| 60+ | 9.59 EUR |
| 260+ | 9.33 EUR |
| 500+ | 8.92 EUR |
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Technische Details 110-13-320-41-801000 Mill-Max
Description: CONN IC DIP SOCKET 20POS GOLD, Packaging: Tube, Features: Open Frame, Decoupling Capacitor, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 110-13-320-41-801000 nach Preis ab 10.37 EUR bis 13.87 EUR
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110-13-320-41-801000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 20POS GOLDPackaging: Tube Features: Open Frame, Decoupling Capacitor Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 86 Stücke: Lieferzeit 10-14 Tag (e) |
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