110-43-320-41-801000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
| Anzahl | Preis |
|---|---|
| 2+ | 11.53 EUR |
| 20+ | 9.33 EUR |
| 40+ | 8.89 EUR |
| 60+ | 8.64 EUR |
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Technische Details 110-43-320-41-801000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Decoupling Capacitor, Packaging: Tube.
Weitere Produktangebote 110-43-320-41-801000 nach Preis ab 7.55 EUR bis 11.74 EUR
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110-43-320-41-801000 | Hersteller : Mill-Max |
IC & Component Sockets 20P TIN PIN GLD CONT |
auf Bestellung 63 Stücke: Lieferzeit 10-14 Tag (e) |
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