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110-83-210-01-839101

110-83-210-01-839101 Preci-dip


Catalog-1062570.pdf Hersteller: Preci-dip
IC & Component Sockets
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Lieferzeit 10-14 Tag (e)
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1+2.94 EUR
10+2.57 EUR
25+2.46 EUR
41+2.39 EUR
82+2.29 EUR
287+2.06 EUR
533+1.9 EUR
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Technische Details 110-83-210-01-839101 Preci-dip

Description: CONN IC DIP SOCKET 10POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.2" (5.08mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (2 x 5), 8 Loaded, Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.

Weitere Produktangebote 110-83-210-01-839101

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110-83-210-01-839101 110-83-210-01-839101 Hersteller : Preci-Dip Default.aspx?c=14&i=1220&p=272&pdf=1&dsku=110-PP-XXX-01-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5), 8 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
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Im Einkaufswagen  Stück im Wert von  UAH