
auf Bestellung 244 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 5.53 EUR |
10+ | 5.03 EUR |
108+ | 4.44 EUR |
252+ | 3.87 EUR |
504+ | 3.77 EUR |
1008+ | 3.2 EUR |
2502+ | 2.99 EUR |
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Technische Details 110-83-422-41-001101 Preci-dip
Description: CONN IC DIP SOCKET 22POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.4" (10.16mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 110-83-422-41-001101
Foto | Bezeichnung | Hersteller | Beschreibung |
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110-83-422-41-001101 | Hersteller : Preci-Dip |
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Produkt ist nicht verfügbar |
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110-83-422-41-001101 | Hersteller : Preci-Dip |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |