Produkte > PRECI-DIP > 110-83-648-41-001101
110-83-648-41-001101

110-83-648-41-001101 Preci-dip

Preci_Dip_01252017_cat_129.pdf
Hersteller: Preci-dip
IC & Component Sockets
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Technische Details 110-83-648-41-001101 Preci-dip

Description: CONN IC DIP SOCKET 48POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 48 (2 x 24), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.

Weitere Produktangebote 110-83-648-41-001101

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
110-83-648-41-001101 110-83-648-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
 Mindestbestellmenge: 504 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-648-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
110-83-648-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 504 Stücke
Im Einkaufswagen  Stück im Wert von  UAH