auf Bestellung 23 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 17+ | 3.2 EUR |
| 20+ | 2.68 EUR |
| 82+ | 2.07 EUR |
| 533+ | 1.8 EUR |
| 1025+ | 1.64 EUR |
| 2501+ | 1.54 EUR |
| 4920+ | 1.45 EUR |
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Technische Details 110-87-210-01-839101 Preci-dip
Description: CONN IC DIP SOCKET 10POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.2" (5.08mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (2 x 5), 8 Loaded, Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 110-87-210-01-839101
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
110-87-210-01-839101 | Hersteller : Preci-Dip |
 Description: CONN IC DIP SOCKET 10POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5), 8 Loaded Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
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