| Anzahl | Privatkunde |
|---|---|
| 1+ | 14.77 EUR |
| 10+ | 13.3 EUR |
| 22+ | 12.52 EUR |
| 44+ | 10.09 EUR |
| 1012+ | 9.07 EUR |
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Technische Details 110-93-318-41-801000 Mill-Max
Description: CONN IC DIP SOCKET 18POS GOLD, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Decoupling Capacitor, Packaging: Tube.
Weitere Produktangebote 110-93-318-41-801000
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
110-93-318-41-801000 | Mill-Max Mfg. Corp. |
Conn DIP Socket RCP 18 POS 2.54mm Solder ST Thru-Hole Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 66 Stücke Im Einkaufswagen Stück im Wert von UAH |
|
110-93-318-41-801000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 18POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame, Decoupling Capacitor Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 88 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 110-93-318-41-801000 |
![]() |
Hersteller: Mill-Max Mfg. Corp.
Conn DIP Socket RCP 18 POS 2.54mm Solder ST Thru-Hole Tube
Conn DIP Socket RCP 18 POS 2.54mm Solder ST Thru-Hole Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 66 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 110-93-318-41-801000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 88 Stücke
Im Einkaufswagen
Stück im Wert von UAH




