auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 12.57 EUR |
| 10+ | 11.39 EUR |
| 22+ | 9.24 EUR |
| 110+ | 7.71 EUR |
| 1012+ | 7.60 EUR |
| 2508+ | 7.46 EUR |
| 5016+ | 7.30 EUR |
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Technische Details 110-93-318-41-801000 Mill-Max
Description: CONN IC DIP SOCKET 18POS GOLD, Packaging: Tube, Features: Open Frame, Decoupling Capacitor, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 110-93-318-41-801000
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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110-93-318-41-801000 | Hersteller : Mill-Max Mfg. Corp. |
 Conn DIP Socket SKT 18 POS 2.54mm Solder ST Thru-Hole Tube |
Produkt ist nicht verfügbar |
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110-93-318-41-801000 | Hersteller : Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 18POS GOLD Packaging: Tube Features: Open Frame, Decoupling Capacitor Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |