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111-93-308-41-001000

111-93-308-41-001000 Mill-Max


MMMC_S_A0004812301_1-2556201.pdf Hersteller: Mill-Max
IC & Component Sockets 8P LONG SOLDER TAIL
auf Bestellung 330 Stücke:

Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
15+3.69 EUR
18+ 2.99 EUR
100+ 2.59 EUR
500+ 2.39 EUR
1000+ 2.05 EUR
2500+ 1.91 EUR
Mindestbestellmenge: 15
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Technische Details 111-93-308-41-001000 Mill-Max

Description: CONN IC DIP SOCKET 8POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.

Weitere Produktangebote 111-93-308-41-001000

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111-93-308-41-001000 111-93-308-41-001000 Hersteller : Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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