| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.92 EUR |
| 10+ | 3.17 EUR |
| 22+ | 3.14 EUR |
| 110+ | 2.78 EUR |
| 506+ | 2.67 EUR |
| 1012+ | 2.32 EUR |
| 2376+ | 2.26 EUR |
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Technische Details 114-87-318-41-134161 Preci-dip
Description: CONN IC DIP SOCKET 18POS GOLD, Features: Open Frame, Part Status: Active, Contact Material - Post: Brass, Packaging: Tube, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount.
Weitere Produktangebote 114-87-318-41-134161 nach Preis ab 2.57 EUR bis 4 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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114-87-318-41-134161 | Preci-Dip |
 Description: CONN IC DIP SOCKET 18POS GOLDFeatures: Open Frame Part Status: Active Contact Material - Post: Brass Packaging: Tube Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount |
auf Bestellung 616 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 114-87-318-41-134161 |
|
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Part Status: Active
Contact Material - Post: Brass
Packaging: Tube
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Part Status: Active
Contact Material - Post: Brass
Packaging: Tube
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
auf Bestellung 616 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 4 EUR |
| 22+ | 3.2 EUR |
| 110+ | 2.86 EUR |
| 506+ | 2.57 EUR |