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115-47-328-41-001000

115-47-328-41-001000 Mill-Max


MMMC_S_A0004813882_1-2556193.pdf Hersteller: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL DIP SOCKET
auf Bestellung 1649 Stücke:

Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
9+6.11 EUR
10+ 5.36 EUR
112+ 4.73 EUR
504+ 3.95 EUR
1008+ 3.38 EUR
2506+ 3.17 EUR
5012+ 2.99 EUR
Mindestbestellmenge: 9
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Technische Details 115-47-328-41-001000 Mill-Max

Description: CONN IC DIP SOCKET 28POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.

Weitere Produktangebote 115-47-328-41-001000

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115-47-328-41-001000 115-47-328-41-001000 Hersteller : Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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