| Anzahl | Preis |
|---|---|
| 1+ | 4.96 EUR |
| 10+ | 4.79 EUR |
| 22+ | 4.05 EUR |
| 110+ | 3.96 EUR |
| 264+ | 3.03 EUR |
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Technische Details 115-83-318-41-003101 Preci-dip
Description: CONN IC DIP SOCKET 18POS GOLD, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.
Weitere Produktangebote 115-83-318-41-003101
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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115-83-318-41-003101 | Hersteller : Preci-Dip |
 Description: CONN IC DIP SOCKET 18POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
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