115-93-210-41-001000 Mill-Max
auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 23.23 EUR |
| 10+ | 19.78 EUR |
| 25+ | 19.59 EUR |
| 41+ | 17.83 EUR |
| 82+ | 16.37 EUR |
| 287+ | 13.5 EUR |
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Technische Details 115-93-210-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 10POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.2" (5.08mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 115-93-210-41-001000 nach Preis ab 18.34 EUR bis 25.03 EUR
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115-93-210-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 10POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
auf Bestellung 82 Stücke: Lieferzeit 10-14 Tag (e) |
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