115-93-316-41-001000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
| Anzahl | Preis |
|---|---|
| 4+ | 4.47 EUR |
| 10+ | 3.8 EUR |
| 25+ | 3.56 EUR |
| 50+ | 3.39 EUR |
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Technische Details 115-93-316-41-001000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Weitere Produktangebote 115-93-316-41-001000
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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115-93-316-41-001000 | Hersteller : Mill-Max |
IC & Component Sockets 16P VERY LOW PROFILE |
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