
auf Bestellung 479 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 3.4 EUR |
10+ | 2.96 EUR |
25+ | 2.78 EUR |
104+ | 2.62 EUR |
260+ | 2.39 EUR |
520+ | 2.06 EUR |
1040+ | 1.67 EUR |
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Technische Details 116-83-308-41-008101 Preci-dip
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Elevated, Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 116-83-308-41-008101
Foto | Bezeichnung | Hersteller | Beschreibung |
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116-83-308-41-008101 | Hersteller : Preci-Dip |
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Produkt ist nicht verfügbar |
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116-83-308-41-008101 | Hersteller : Preci-Dip |
![]() Features: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |