| Anzahl | Preis |
|---|---|
| 1+ | 3.04 EUR |
| 10+ | 2.66 EUR |
| 25+ | 2.52 EUR |
| 84+ | 2.36 EUR |
| 252+ | 2.15 EUR |
| 504+ | 1.85 EUR |
| 1008+ | 1.65 EUR |
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Technische Details 116-83-310-41-006101 Preci-dip
Description: CONN IC DIP SOCKET 10POS GOLD, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 10 (2 x 5), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Elevated, Open Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Weitere Produktangebote 116-83-310-41-006101
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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116-83-310-41-006101 | Hersteller : Preci-Dip |
 Description: CONN IC DIP SOCKET 10POS GOLDContact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper |
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