
auf Bestellung 354 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 4.52 EUR |
10+ | 3.96 EUR |
120+ | 3.54 EUR |
510+ | 2.94 EUR |
1020+ | 2.52 EUR |
2880+ | 2.36 EUR |
5760+ | 2.24 EUR |
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Technische Details 116-87-314-41-007101 Preci-dip
Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Bulk, Features: Elevated, Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 116-87-314-41-007101
Foto | Bezeichnung | Hersteller | Beschreibung |
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116-87-314-41-007101 | Hersteller : Preci-Dip |
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Produkt ist nicht verfügbar |
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116-87-314-41-007101 | Hersteller : Preci-Dip |
![]() Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |