Produkte > ARIES ELECTRONICS > 12-0518-11
12-0518-11

12-0518-11 Aries Electronics

12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
IC & Component Sockets SINGLE ROW COLLET SOLDER TAIL 12 PINS
auf Bestellung 71 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+5.21 EUR
10+4.74 EUR
25+4.49 EUR
50+4.38 EUR
100+4.16 EUR
250+3.64 EUR
500+3.53 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 12-0518-11 Aries Electronics

Description: CONN SOCKET SIP 12POS GOLD, Termination: Solder, Number of Positions or Pins (Grid): 12 (1 x 12), Type: SIP, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled.

Weitere Produktangebote 12-0518-11

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
12-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 12POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Produkt ist nicht verfügbar
 Mindestbestellmenge: 295 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Produkt ist nicht verfügbar
Mindestbestellmenge: 295 Stücke
Im Einkaufswagen  Stück im Wert von  UAH