12-0518-11 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.21 EUR |
| 10+ | 4.74 EUR |
| 25+ | 4.49 EUR |
| 50+ | 4.38 EUR |
| 100+ | 4.16 EUR |
| 250+ | 3.64 EUR |
| 500+ | 3.53 EUR |
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Lieferzeit:
10-14 Tag (e)
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Technische Details 12-0518-11 Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 12 (1 x 12), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Weitere Produktangebote 12-0518-11
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
| 12-0518-11 | Aries Electronics |
 Description: CONN SOCKET SIP 12POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 295 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 12-0518-11 |
|
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 12POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 295 Stücke
Im Einkaufswagen
Stück im Wert von UAH