
12-810-90C Aries Electronics
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 21.21 EUR |
10+ | 18.85 EUR |
25+ | 17.34 EUR |
100+ | 16.44 EUR |
250+ | 15.01 EUR |
500+ | 14.04 EUR |
1000+ | 12.88 EUR |
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Technische Details 12-810-90C Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Vertical, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 12 (2 x 6), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 12-810-90C nach Preis ab 12.49 EUR bis 21.7 EUR
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12-810-90C | Hersteller : Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 128 Stücke: Lieferzeit 10-14 Tag (e) |
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12-810-90C | Hersteller : Aries Electronics |
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auf Bestellung 190 Stücke: Lieferzeit 14-21 Tag (e) |
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