12-810-90C Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.24 EUR |
| 10+ | 22.43 EUR |
| 25+ | 20.63 EUR |
| 100+ | 19.56 EUR |
| 250+ | 17.86 EUR |
| 500+ | 16.71 EUR |
| 1000+ | 15.33 EUR |
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Technische Details 12-810-90C Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 12 (2 x 6), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Vertical, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 12-810-90C nach Preis ab 17.73 EUR bis 26.18 EUR
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12-810-90C | Aries Electronics |
 Description: CONN IC DIP SOCKET 12POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 12 (2 x 6) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole, Right Angle, Vertical Features: Closed Frame Packaging: Bulk |
auf Bestellung 354 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 12-810-90C |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 12POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
auf Bestellung 354 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 26.18 EUR |
| 10+ | 22.25 EUR |
| 25+ | 20.86 EUR |
| 50+ | 19.86 EUR |
| 100+ | 18.91 EUR |
| 250+ | 17.73 EUR |