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121-13-652-41-001000 Mill-Max Manufacturing Corp.


54_Mill%20Max%20catalog.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Wire Wrap
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
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Technische Details 121-13-652-41-001000 Mill-Max Manufacturing Corp.

Description: CONN IC DIP SOCKET 52POS GOLD, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Wire Wrap, Number of Positions or Pins (Grid): 52 (2 x 26), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing.

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121-13-652-41-001000 Hersteller : Mill-Max 54_Mill%20Max%20catalog.pdf IC & Component Sockets 52P DIP SKT 1 LEVEL WRAPOST
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