121-13-952-41-001000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Wire Wrap
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
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Technische Details 121-13-952-41-001000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD, Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Wire Wrap, Number of Positions or Pins (Grid): 52 (2 x 26), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.9" (22.86mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm).
Weitere Produktangebote 121-13-952-41-001000
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 121-13-952-41-001000 | Hersteller : Mill-Max |
IC & Component Sockets 52P DIP SKT 1 LEVEL WRAPOST |
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