14-3511-10 Aries Electronics


12004-dip-test-socket-337404.pdf
Hersteller: Aries Electronics
IC & Component Sockets SOLDER TAIL 14 PINS TIN
auf Bestellung 125 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+4.4 EUR
10+3.22 EUR
100+2.46 EUR
2500+2.45 EUR
5000+2.39 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 14-3511-10 Aries Electronics

Description: CONN IC DIP SOCKET 14POS TIN, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled.

Weitere Produktangebote 14-3511-10

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
14-3511-10 Hersteller : Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH