auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 16.19 EUR |
| 10+ | 13.2 EUR |
| 25+ | 11.44 EUR |
| 100+ | 10.75 EUR |
| 250+ | 9.91 EUR |
| 500+ | 9.84 EUR |
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Technische Details 14-810-90 Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Vertical, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote 14-810-90 nach Preis ab 9.54 EUR bis 16.32 EUR
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14-810-90 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 14POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 573 Stücke: Lieferzeit 10-14 Tag (e) |
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