14-810-90R Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 20.86 EUR |
| 10+ | 18.05 EUR |
| 25+ | 16.92 EUR |
| 50+ | 16.1 EUR |
| 100+ | 15.33 EUR |
| 250+ | 13.83 EUR |
| 400+ | 12.96 EUR |
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10-14 Tag (e)
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Technische Details 14-810-90R Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Right Angle, Vertical, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote 14-810-90R nach Preis ab 15.41 EUR bis 21.32 EUR
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14-810-90R | Aries Electronics |
 Description: CONN IC DIP SOCKET 14POS TINFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 104 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 14-810-90R |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.32 EUR |
| 10+ | 18.14 EUR |
| 25+ | 16.99 EUR |
| 50+ | 16.18 EUR |
| 100+ | 15.41 EUR |