14-810-90R Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 20.86 EUR |
| 10+ | 18.05 EUR |
| 25+ | 16.92 EUR |
| 50+ | 16.1 EUR |
| 100+ | 15.33 EUR |
| 250+ | 13.83 EUR |
| 400+ | 12.96 EUR |
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Technische Details 14-810-90R Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Vertical, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 14-810-90R nach Preis ab 15.41 EUR bis 21.32 EUR
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14-810-90R | Aries Electronics |
 Description: CONN IC DIP SOCKET 14POS TINContact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6 Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole, Right Angle, Vertical Features: Closed Frame Packaging: Bulk |
auf Bestellung 104 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 14-810-90R |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 14POS TIN
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.32 EUR |
| 10+ | 18.14 EUR |
| 25+ | 16.99 EUR |
| 50+ | 16.18 EUR |
| 100+ | 15.41 EUR |