169-PLS17012-12 Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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Technische Details 169-PLS17012-12 Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Termination: Solder, Operating Temperature: -65°C ~ 125°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 169-PLS17012-12
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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169-PLS17012-12 | Hersteller : Aries Electronics |
IC & Component Sockets |
Produkt ist nicht verfügbar |