
178-H15-613R577 NorComp
auf Bestellung 255 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 20.28 EUR |
10+ | 17.9 EUR |
25+ | 15.63 EUR |
90+ | 13.64 EUR |
270+ | 12.43 EUR |
540+ | 11.83 EUR |
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Technische Details 178-H15-613R577 NorComp
Description: CONN D-SUB HD PLG 15POS R/A SLDR, Packaging: Tray, Features: Board Lock, Grounding Indents, Mounting Brackets, Connector Type: Plug, Male Pins, Contact Finish: Gold, Current Rating (Amps): 3A per Contact, Mounting Type: Panel Mount, Through Hole, Right Angle, Number of Positions: 15, 15, Number of Rows: 3, 3, Contact Type: Signal, Flange Feature: Mating Side, Female Screwlock (4-40), Termination: Solder, Connector Style: D-Sub, High Density - Stacked, Contact Finish Thickness: FLASH, Material Flammability Rating: UL94 V-0, Shell Material, Finish: Steel, Nickel Plated, Shell Size, Connector Layout: 1 (DE, E); 1 (DE, E) High Density, Backset Spacing: 0.350" (8.89mm).
Weitere Produktangebote 178-H15-613R577 nach Preis ab 14.65 EUR bis 24.15 EUR
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178-H15-613R577 | Hersteller : NorComp Inc. |
![]() Packaging: Tray Features: Board Lock, Grounding Indents, Mounting Brackets Connector Type: Plug, Male Pins Contact Finish: Gold Current Rating (Amps): 3A per Contact Mounting Type: Panel Mount, Through Hole, Right Angle Number of Positions: 15, 15 Number of Rows: 3, 3 Contact Type: Signal Flange Feature: Mating Side, Female Screwlock (4-40) Termination: Solder Connector Style: D-Sub, High Density - Stacked Contact Finish Thickness: FLASH Material Flammability Rating: UL94 V-0 Shell Material, Finish: Steel, Nickel Plated Shell Size, Connector Layout: 1 (DE, E); 1 (DE, E) High Density Backset Spacing: 0.350" (8.89mm) |
auf Bestellung 182 Stücke: Lieferzeit 10-14 Tag (e) |
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